All products
特靠普粘合剂技术 - 提供粘合剂、密封胶、涂层及点胶设备的行业解决方案
TEKOPU Engineering
TEKOPU Engineering M-NT 2040 E2
Chromium-free conversion coating for etch passivating aluminum
箱
TEKOPU Engineering
TEKOPU Engineering M-NT 4595 R4
Chromium-free, sprayable conversion coating agent for aluminum
30 kg
TEKOPU Engineering
TEKOPU Engineering M-NT 4595 R5
Chromium-free conversion coating for aluminum
25 kg
TEKOPU Engineering
TEKOPU Engineering M-NT 8001
Phosphate- and fluoride-free conversion treatment for metal
散装
TEKOPU Engineering
TEKOPU Engineering M-NT NT-1
Phosphate and heavy metal-free conversion coating for a variety of metals
25 kg
TEKOPU Engineering
TEKOPU Engineering M-PP 930 R
Water-based autodeposition coating for ferrous metals
200 kg
TEKOPU Engineering
TEKOPU Engineering M-PT 90A
Chromium-free post-treatment chemical for corrosion resistance
25 kg
TEKOPU Thermal
TEKOPU Thermal GAP FILLER TGF 10000
Silicone-based gap filler for electronics cooling applications
1200 cc
TEKOPU Thermal
TEKOPU Thermal GAP FILLER TGF 1500
Versatile, cost-effective dispensable liquid
Other pack. types, not spec.
TEKOPU Thermal
TEKOPU Thermal GAP FILLER TGF 1500LVO
Versatile dispensable liquid with low outgassing
400 cc
TEKOPU Thermal
TEKOPU Thermal GAP FILLER TGF 2030APS
Silicone-free, stick-on Gap Filler for high throughput assembly applications
桶/滚筒
TEKOPU Thermal
TEKOPU Thermal GAP FILLER TGF 3500LVO
High-performance dispensable liquid with low outgassing
20 oz
TEKOPU Thermal
TEKOPU Thermal GAP FILLER TGF 3600
Versatile, high-performance dispensable liquid
1200 cc
TEKOPU Thermal
TEKOPU Thermal GAP PAD® TGP 3000
Soft, fiberglass-reinforced insulation pad - low stress applications
板材
TEKOPU Thermal
TEKOPU Thermal GAP PAD® TGP 5000
Soft, fiberglass-reinforced insulation pad - high performance
板材
TEKOPU Thermal
TEKOPU Thermal GAP PAD® TGP EMI1000
High-conformable pad combining thermal dissipation and EMI absorption
l13.6mmw13.6mmh2.54mm
TEKOPU Thermal
TEKOPU Thermal HI FLOW THF 1600P
High performance, electrically insulating, reinforced pad
板材
TEKOPU Thermal
TEKOPU Thermal HI FLOW THF 5000UT
Thin bond line, low pressure - for advanced devices
板材
TEKOPU Thermal
TEKOPU Thermal LIQUI BOND TLB SA2005RT
Dispensable liquid for structural component bonding - high performance
桶
TEKOPU Thermal
TEKOPU Thermal LIQUI FORM TLF 6000HF
Pre-cured thermal gel for electronic component cooling assembly applications
150 cc
TEKOPU Thermal
TEKOPU Thermal SIL PAD® TSP 3500
Electrically insulating pad - high performance
板材
TEKOPU Thermal
TEKOPU Thermal SIL PAD® TSP K1300
Electrically insulating, polyimide reinforced pad - high performance
板材
TEKOPU
TEKOPU TEKOPU Thermal TLF 20000CGEL
l 30 cc
TEKOPU
TEKOPU 384
Thermally-conductive adhesive for bonding heat-generating electronic components
300 ml