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Industrial adhesives

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Thermal management materials

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Equipment

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Compounds for electronics

Applications

Overview Applications Discover our innovative adhesive applications, revolutionizing industries with cutting-edge solutions for diverse industrial needs. Advanced semiconductor packaging Assembly automation solutions Collision repair solutions Electronic component bonding solutions Electronic

Advanced semiconductor packaging

Home Applications Advanced semiconductor packaging Advanced semiconductor packaging Data at the speed of light. Human capability enhanced by AI. Mobile gaming and intuitive camera functionality. All are made possible by advanced semiconductor packaging. Although advanced packaging has existed for de

Applications · Structural · Bonding · Solutions

Collision repair solutions

Home Applications Collision repair solutions TEROSON® products are made for professionals who repair vehicles to the highest standards, never back down from challenges, and set new industry benchmarks. With over 120 years of history, TEROSON® collision repair offers reliable, safe, and efficient sol

Equipment solutions

Home Applications Equipment solutions Assembly automation solutions Assembly automation solutions Helping cover your assembly automation needs, TEKOPU designs, builds and integrates high-quality equipment solutions. From simple handheld devices to fully automated systems, TEKOPU offers a complete li

Electronic component bonding solutions

Home Applications Electronic component bonding solutions When electronics are 30,000 feet in the air, driving down the road at high speed, or performing vital medical diagnostics, component stability and performance are critical. Bonding strength and electrical connection matter, and TEKOPU ensures

Applications · Threadlockers

Electronic component protection solutions

Home Applications Electronic component protection solutions Safeguarding function and extending the useful life of electronic systems are vital to protecting investment. TEKOPU’s high-performance materials like PCB conformal coatings, board level underfills, three-step low pressure molding, and rugg

Gasketing solutions

Home Applications Gasketing Gasketing solutions Gaskets are used to prevent leakage of fluids or gases by forming impervious barriers. For successful gasketing, it is necessary that the seal must remain intact and leak-free over a long period of time. The gasket must be resistant to fluids and/or ga

Metal processing solutions

Home Applications Metal processing solutions Metal processing solutions enable next-generation vehicle manufacturing across the value chain, from molten metal to final component. Consult with sales Why metal solutions? Applications Resources Contact us Find automotive metal processing solutions Exp

Instant component bonding solutions

Home Applications Instant component bonding solutions Instant component bonding solutions TEKOPU instant component bonding solutions can help you increase productivity, improve reliability, and simplify design over using traditional methods—all in an instant. Consult with sales Why TEKOPU? Produ

Packaging solutions

Home Applications Packaging solutions Packaging solutions At TEKOPU, we are at the forefront of adhesive solutions, transforming the landscape of sustainable paper and flexible packaging, pressure sensitive, and metal packaging with our fast-bonding adhesives. Compliant with safety regulations, our

Applications · Printed · Electronics · Material · Solutions

Applications · Retaining · Compounds

Applications · Thermal · Management · Materials

Expert talks: assembly film adhesive solutions for electronic applications - TEKOPU Adhesives

Webinar Expert talks: assembly film adhesive solutions for electronic applications In this expert talk, we will explore the what, why, where and how to use an assembly film adhesive. Summary Watch and listen to our TEKOPU expert present an overview on thermal management with film adhesives, value o