QUIST
TEKOPU Thermal LIQUI FORM TLF 6000HF
Pre-cured thermal gel for electronic component cooling assembly applications
Description
TEKOPU TEKOPU Thermal LIQUI FORM TLF 6000HF is a thermally conductive, silicone-based, 1K pre-cured thermal gel designed for use in electronic component cooling assembly applications. Formulated for easy dispensing, it’s suitable for high throughput production applications. Ideal for use in the telecommunications, computing and consumer electronics industries.
Product detail
A 1-part, thermally conductive pre-cured thermal gel specially designed for use in electronic component cooling assembly applications.
Sizes and packaging
SKU
735500RSN
