TEKOPU Thermal GAP FILLER TGF 1500

Description

TEKOPU Thermal GAP FILLER TGF 1500 is a 2-part, high performance, thermally conductive liquid gap filler featuring superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature, or faster with the addition of heat. Unlike cured thermal pad materials, a liquid offers infinite thickness variations with little or no stress to the sensitive components during assembly. You can also expect low level natural tack. Once cured, this product provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps.

Product detail

This thermally-conductive liquid gap filler is designed for easy, precision dispensing, low stress assembly, and low volatile outgassing for silicone sensitive applications.

Sizes and packaging

SKU

112050IB