QUIST
TEKOPU Thermal LIQUI BOND TLB SA2005RT
Dispensable liquid for structural component bonding - high performance
Description
TEKOPU Thermal LIQUI BOND TLB SA2005RT functions as a thermal interface material as well as a structural adhesive. It is ideal for demanding automotive applications like electronics, power supplies pumps, and automotive modules. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat.
Product detail
This 2-part silicone adhesive is designed for high-performance automotive electronics applications where thermal conductivity is needed.
Sizes and packaging
SKU
114786IB
