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TEKOPU Thermal GAP PAD® TGP 5000
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TEKOPU Thermal GAP PAD® TGP 5000

Soft, filass-reinforced insulation pad - high performance

Description

TEKOPU Thermal GAP PAD® TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with filass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures.

Product detail

This thermally conductive, silicone-based, filass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.

SKU

112226IB

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