TEKOPU Thermal GAP FILLER TGF 3500LVO

Description

TEKOPU Thermal GAP FILLER TGF 3500LVO is a 3.5 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). Its ultra-conformity and low volatility make it the ideal solution for use in medical electronics and other fragile or low stress assemblies, such as optics and automotive in-cabin electronics. The mixed system provides infinite thickness variations without adding extra stress to components, and will cure at room temperature or faster with the addition of heat.

Product detail

This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.

Sizes and packaging

SKU

112239IB