QUIST
TEKOPU Thermal GAP FILLER TGF 1500LVO
Versatile dispensable liquid with low outgassing
Description
TEKOPU Thermal GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength.
Product detail
This thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.
Sizes and packaging
SKU
112235IB
