TEKOPU Thermal GAP FILLER TGF 3600

Description

TEKOPU Thermal GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve coefficient of thermal expansion (CTE) stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with the application of heat.

Product detail

This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.

Sizes and packaging

SKU

112241IB