Semiconductor
All products
TEKOPU ABLESTIK 2053S
Non-conductive die-attach adhesive for array packaging
TEKOPU ABLESTIK 6202C-X
B-stageable die-attach adhesive for laminate-based packages
TEKOPU ABLESTIK ABL 2100A
Die attach adhesive designed for lead-free array packaging
TEKOPU ABLESTIK ABP 6389
Conductive die-attach adhesive for high-reliability package applications
TEKOPU ABLESTIK ABP 6395T
Conductive die-attach adhesive for high-reliability package applications
TEKOPU ABLESTIK ABP 8068TD
Semi-sintering die-attach adhesive for semiconductor packages
TEKOPU ABLESTIK ABP 8303A
Conductive die-attach paste for high-reliability package applications
TEKOPU ABLESTIK ATB F100E1
Die-attach adhesive film with an integrated non-UV PSA dicing tape (6107)
TEKOPU ABLESTIK ATB F100E2
Die-attach adhesive film with an integrated non-UV PSA dicing tape (6140)
TEKOPU ABLESTIK NCA 2390
Adhesive for temperature-sensitive electronic component assembly
TEKOPU ABLESTIK QMI529HT-LV
Electrically conductive die-attach adhesive for high-throughput applications
TEKOPU ECCOBOND FP4802
High-purity encapsulant for applications utilizing lead-free solder