TEKOPU
TEKOPU ABLESTIK NCA 2390
Adhesive for temperature-sensitive electronic component assembly
Description
TEKOPU ABLESTIK NCA 2390 is a 1-part, dual cure adhesive formulated for use in the assembly of temperature-sensitive electronic components, especially camera modules. It temporarily cures when exposed to UV light (thereby allowing for adjustments) with a secondary thermal cure at low temperature. It is highly thixotropic for ease of handling and application, and is non-conductive.
Product detail
A 1-part, highly thixotropic, non-conductive, dual cure adhesive specially formulated for use in the assembly of temperature-sensitive electronic components.
Sizes and packaging
SKU
118952IB
