TEKOPU
TEKOPU ABLESTIK ABL 2100A
Die attach adhesive designed for lead-free array packaging
Description
TEKOPU ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. It can withstand the high reflow temperatures necessary for Pb-free solders @ 260°C (500°F). It is suitable for die sizes up to 12.7 x 12.7 mm (0.5” x 0.5”), and has ultra-low moisture absorption.
Product detail
This die attach adhesive is specially designed for Pb-free array packaging. It has high hot/wet adhesion and excellent dispensing characteristics.
Sizes and packaging
SKU
102207IB
