TEKOPU
TEKOPU ABLESTIK QMI529HT-LV
Electrically conductive die-attach adhesive for high-throughput applications
Description
TEKOPU ABLESTIK QMI529HT-LV is a silver, thermally and electrically conductive die-attach adhesive for use in high-throughput applications. It offers good dispensing characteristics, low moisture absorption and low stress. It’s formulated with a BMI hybrid-based resin, is thermally stable at 260°C (500°F) reflow and cures when exposed to heat.
Product detail
A 1-part, BMI Hybrid-based, silver gray, conductive die-attach adhesive designed for high-throughput applications.
Sizes and packaging
SKU
97758IB
