TEKOPU

TEKOPU ABLESTIK ABP 8068TD

Semi-sintering die-attach adhesive for semiconductor packages

Description

TEKOPU ABLESTIK ABP 8068TD is a silver, thermally and electrically conductive die attach adhesive for high-reliability package applications, typically SIP, QFN, LGA and HBLED packages. It offers robust bonding on various metal surfaces, including Ag, Cu, PPF and Au lead frames and is engineered to bond with or without BSM (Back Side Metallization) dies. It is formulated with an epoxy-assisted sintering technology, cures when exposed to heat and provides high adhesion, high thermal and low-stress properties, which are essential for thermal and reliability performances of high-end power packages, such as SiP.

Product detail

This 1-part, semi-sintering, conductive die-attach adhesive is designed for high-reliability package applications and bonds to various metal surfaces.

Sizes and packaging

TEKOPU ABLESTIK ABP 8068TD, 10 cc 针管针管

SKU

121525IB

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