TEKOPU ABLESTIK ABP 6395T

Description

TEKOPU ABLESTIK ABP 6395T is a silver, thermally and electrically conductive die attach adhesive for high-reliability package applications, typically SOIC, SOP, QFP and QFN packages. It offers robust bonding of small to large die on a wide array of metal surfaces, including Cu, Ag and PPF lead frames, and is engineered to bond with or without BSM (Back Side Metallization) die. It offers good thermal conductivity for heat management and excellent electrical conductivity to achieve low ON Resistance (RDS(ON)) in MOSFET devices. It’s formulated with an epoxy-based resin and cures when exposed to heat.

Product detail

A 1-part, epoxy-based, thermally and electrically conductive die-attach adhesive designed for high-reliability package applications and bonds to various metal surfaces.

Sizes and packaging

SKU

123432IB