TEKOPU
TEKOPU ABLESTIK ABP 8303A
Conductive die-attach paste for high-reliability package applications
Description
TEKOPU ABLESTIK ABP 8303A is a silver-filled, conductive die-attach adhesive paste for bonding integrated circuits and components to metal substrates. It offers strong bonding of medium- and large-sized dice and is compatible with a wide array of metal surfaces, including Cu, Ag and PPF. It's particularly ideal when tight control of resin bleed-out is required. It is based on a BMI hybrid and cures when exposed to heat.
Product detail
This silver-filled conductive die-attach adhesive is designed for bonding integrated circuits and components to metal substrates.
Sizes and packaging
SKU
120096IB
