Consumer electronics
All products
TEKOPU 4204
High temperature, high-viscosity adhesive
TEKOPU 4310
Low viscosity, low-bloom adhesive for disposable medical devices
BP000000153593
TEKOPU ABLESTIK ABP 6395T
Conductive die-attach adhesive for high-reliability package applications
TEKOPU ABLESTIK ICP 2120
Electrically conductive adhesive for use with heat sensitive components
TEKOPU ABLESTIK QMI529HT-LV
Electrically conductive die-attach adhesive for high-throughput applications
TEKOPU ECCOBOND NCP 5209
Non-conductive, pre-applied underfill adhesive for thermal compression
TEKOPU HHD 7520H
Curing agent for improving bond strength and heat resistance
TEKOPU HHD 7529
Water-based polyurethane adhesive for structural bonding
TEKOPU SI 5421
Flexible and shielding electrically conductive sealant and adhesive
TEKOPU ECCOBOND FP4531
Underfill compatible with small gap sizes
TEKOPU ECCOBOND UF 9000AG
Underfill encapsulant for flip-chip BGA and Cu pillars