TEKOPU
TEKOPU ABLESTIK ICP 2120
Electrically conductive adhesive for use with heat sensitive components
Description
TEKOPU ABLESTIK ICP 2120 is an electrically conductive adhesive specially designed for use with heat-sensitive components often found within CCM structures for mobile devices. The room temperature, moisture cure capability of the material protects delicate substrates, while providing excellent electrical conductivity, low direct contact resistance (DCR) and good dispensing performance for high-volume production environments.
Product detail
This highly reliable, highly stable electrically conductive adhesive is formulated for use with heat-sensitive components often found within compact camera module (CCM) structures for mobile devices.
Sizes and packaging
SKU
123393IB
