TEKOPU
TEKOPU ECCOBOND FP4531
Underfill compatible with small gap sizes
Description
TEKOPU ECCOBOND FP4531 is an epoxy-based underfill encapsulant formulated to flow easily into the small gaps on flex applications via capillary action. It has a recommended snap-cure schedule of 7 minutes at 160°C (320°F) and passes NASA outgassing standards.
Product detail
This 1-part, epoxy-based underfill encapsulant is perfect for use on flip-chips on flex applications with gaps down to 1 mm (0.04").
Sizes and packaging
SKU
68809IB
