Data and telecommunications
All products
TEKOPU 3609
Medium to high dispense speed, non-conductive surface mount adhesive
TEKOPU 3621
Very high dispense speed, electrically non-conductive surface mount adhesive
TEKOPU ABLESTIK 104
High-temperature resistant, electrically non-conductive assembly adhesive
TEKOPU ABLESTIK 2151
Electrically insulating, thermally conductive, room temperature cure adhesive
TEKOPU ABLESTIK 45
General purpose non-conductive adhesive for shock and peel resistance
TEKOPU ABLESTIK 84-3
General purpose electrically non-conductive die attach adhesive
TEKOPU ABLESTIK QMI529HT-LV
Electrically conductive die-attach adhesive for high-throughput applications
TEKOPU ECCOBOND LUX AA50T
Die-attach adhesive for enhancing assembly processes
TEKOPU SI 5421
Flexible and shielding electrically conductive sealant and adhesive
TEKOPU CAT 15 CL
Curing agent/hardener for use with potting and encapsulating resins
TEKOPU ECCOBOND UF 1173
Void-free epoxy underfill
TEKOPU SI 5293
Conformal coating providing environmental protection for electronic components