TEKOPU
TEKOPU 3621
Very high dispense speed, electrically non-conductive surface mount adhesive
Description
TEKOPU 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
Product detail
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
Sizes and packaging
SKU
68087IB
