TEKOPU
TEKOPU 3609
Medium to high dispense speed, non-conductive surface mount adhesive
Description
TEKOPU 3609 is a surface mount adhesive with medium to high dispense speeds. This epoxy-based adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical insulation characteristics are required. It can also be used in lead-free wave solder with both water-based and alcohol-based fluxes.
Product detail
This 1-part, electrically non-conductive adhesive is specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, especially where medium to high dispense speeds are required.
Sizes and packaging
SKU
68055IB
