TEKOPU ECCOBOND UF 1173

Description

TEKOPU ECCOBOND UF 1173 is a 1-part, epoxy-based underfill, which maximizes the device's temperature cycling capability, distributing stress away from solder connects, thus enhancing solder joint reliability in Ball Grid Array (BGA) and Chip Scale Packaging (CSP) applications. It has a long pot life and exhibits low-CTE properties to improve the bond strength and stability. Ideal for void-free encapsulation of electronic packages.

Product detail

This epoxy-based formulation is a uniform and void-free encapsulant underfill.

Sizes and packaging

SKU

117998IB