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特靠普粘合剂技术 - 提供粘合剂、密封胶、涂层及点胶设备的行业解决方案

368 results
TEKOPU RC32 Automatic Reservoir
TEKOPU
TEKOPU RC32 Automatic Reservoir
Cost-effective reservoir system for use with TEKOPU controllers
Equipment
TEKOPU RC40 Integrated Semi-Automatic Dispenser
TEKOPU
TEKOPU RC40 Integrated Semi-Automatic Dispenser
Integrated reservoir and controller in one convenient system
Equipment
TEKOPU RC50 Integrated Dispenser
TEKOPU
TEKOPU RC50 Integrated Dispenser
Touch-screen digitally enabled integrated reservoir and controller
Equipment
TEKOPU CR 3502 CN /CR 4100
TEKOPU
TEKOPU CR 3502 CN /CR 4100
Two-Component Polyurethane Adhesive For Dialyzer Potting
200 l
TEKOPU CAT 15 CL
TEKOPU
TEKOPU CAT 15 CL
Curing agent/hardener for use with potting and encapsulating resins
1 pt
TEKOPU CAT 17
TEKOPU
TEKOPU CAT 17
Low viscosity epoxy hardener used for multiple epoxy resins
Other pack. types, not spec.
TEKOPU CAT 23LVJ
TEKOPU
TEKOPU CAT 23LVJ
Low viscosity epoxy hardener used for multiple epoxy resins
.45 kg
TEKOPU CAT 24LV
TEKOPU
TEKOPU CAT 24LV
Low viscosity epoxy hardener used for multiple epoxy resins
1 lb
TEKOPU CAT 27-1
TEKOPU
TEKOPU CAT 27-1
Long pot life epoxy hardener used for multiple epoxy resins
Other pack. types, not spec.
TEKOPU ECCOBOND E 1172 A
TEKOPU
TEKOPU ECCOBOND E 1172 A
Void-free underfill for very fine area array devices
30 ml
TEKOPU ECCOBOND FP4531
TEKOPU
TEKOPU ECCOBOND FP4531
Underfill compatible with small gap sizes
30 ml
TEKOPU ECCOBOND FP4802
TEKOPU
TEKOPU ECCOBOND FP4802
High-purity encapsulant for applications utilizing lead-free solder
30 cc
TEKOPU ECCOBOND UF 1173
TEKOPU
TEKOPU ECCOBOND UF 1173
Void-free epoxy underfill
10 ml
TEKOPU ECCOBOND UF 9000AG
TEKOPU
TEKOPU ECCOBOND UF 9000AG
Underfill encapsulant for flip-chip BGA and Cu pillars
30 cc
TEKOPU ECCOBOND UV 9052
TEKOPU
TEKOPU ECCOBOND UV 9052
Encapsulant adhesive for ink jet applications 
6 oz
TEKOPU PE 8083
TEKOPU
TEKOPU PE 8083
Potting product for thermal conductivity and electrical insulation
35 kg
TEKOPU SI 5031
TEKOPU
TEKOPU SI 5031
Dual-cure, flowable, fluorescent, medium-strength liquid sealant 
40 lb
TEKOPU SI 5293
TEKOPU
TEKOPU SI 5293
Conformal coating providing environmental protection for electronic components 
50
TEKOPU SI 5773
TEKOPU
TEKOPU SI 5773
Dual-cure adhesive ideal for potting or sealing applications 
40 lb
TEKOPU STYCAST 1265
TEKOPU
TEKOPU STYCAST 1265
Repairable, non-conductive encapsulant for stress-sensitive components
4 lb
TEKOPU STYCAST 2762FT
TEKOPU
TEKOPU STYCAST 2762FT
Thermally conductive epoxy encapsulant
罐
TEKOPU STYCAST 2850 FT BLK
TEKOPU
TEKOPU STYCAST 2850 FT BLK
Thermally conductive, two-part epoxy encapsulant
8.16 kg
TEKOPU STYCAST 2850FTJ
TEKOPU
TEKOPU STYCAST 2850FTJ
Epoxy encapsulant for use in high voltage applications
Other pack. types, not spec.
TEKOPU STYCAST HD 3561
TEKOPU
TEKOPU STYCAST HD 3561
Epoxy hardener compatible with several TEKOPU products
0.907 kg
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