TEKOPU ECCOBOND E 1172 A

Description

TEKOPU ECCOBOND E 1172 A is a void-free, epoxy-based underfill encapsulant designed for use on very fine area array devices where SMT transparent processing is critical. It can be used on flip-chip devices with as small as 25-micron geometries. When applied, it provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.

Product detail

This 1-part, epoxy-based underfill encapsulant is designed for use on flip-chip devices with as small as 25 μm geometries.

Sizes and packaging

SKU

82162IB