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特靠普粘合剂技术 - 提供粘合剂、密封胶、涂层及点胶设备的行业解决方案

368 results
173025AG
TEKOPU
173025AG
1 l
TEKOPU AA 3926
TEKOPU
TEKOPU AA 3926
General purpose, high viscosity adhesive for medical devices
1 l
BP000000153593
TEKOPU
BP000000153593
1 l
TEKOPU AA 3942
TEKOPU
TEKOPU AA 3942
Medical-grade UV acrylic liquid for fast cure, flexibility and high adhesion
1 l
TEKOPU AA 3943
TEKOPU
TEKOPU AA 3943
UV light-cure adhesive offering superior sterilization resistance
1 l
TEKOPU AA 3951
TEKOPU
TEKOPU AA 3951
Highly flexible, low viscosity medical-grade adhesive
25 ml
TEKOPU AA 3953
TEKOPU
TEKOPU AA 3953
Medium viscosity adhesive for plastic bonding
1 l
SAP_IB-55322
TEKOPU
SAP_IB-55322
1 l
TEKOPU AA 3961
TEKOPU
TEKOPU AA 3961
Wicking-grade adhesive for disposable medical devices
1 l
BP000000268906
TEKOPU
BP000000268906
25 ml1 l
TEKOPU AA 3972
TEKOPU
TEKOPU AA 3972
Medium viscosity, medical-grade adhesive for soft PVC and metals
1 l
TEKOPU ABLESTIK 104
TEKOPU
TEKOPU ABLESTIK 104
High-temperature resistant, electrically non-conductive assembly adhesive
罐
BP000000153579
TEKOPU
BP000000153579
300 ml
TEKOPU ABLESTIK 2053S
TEKOPU
TEKOPU ABLESTIK 2053S
Non-conductive die-attach adhesive for array packaging
10 cc
BP000000153570
TEKOPU
BP000000153570
1 l
TEKOPU ABLESTIK 2151
TEKOPU
TEKOPU ABLESTIK 2151
Electrically insulating, thermally conductive, room temperature cure adhesive
Any kind of pack., incl. bulk
TEKOPU ABLESTIK 2332-17
TEKOPU
TEKOPU ABLESTIK 2332-17
Solvent-free epoxy adhesive for a wide variety of substrates
Any kind of pack., incl. bulk
TEKOPU ABLESTIK 45
TEKOPU
TEKOPU ABLESTIK 45
General purpose non-conductive adhesive for shock and peel resistance
罐
TEKOPU ABLESTIK 6202C-X
TEKOPU
TEKOPU ABLESTIK 6202C-X
B-stageable die-attach adhesive for laminate-based packages
6 oz
BP000000153505
TEKOPU
BP000000153505
1 l
TEKOPU ABLESTIK 84-3
TEKOPU
TEKOPU ABLESTIK 84-3
General purpose electrically non-conductive die attach adhesive
10 cc
BP000000153601
TEKOPU
BP000000153601
1 l
TEKOPU ABLESTIK ABL 2100A
TEKOPU
TEKOPU ABLESTIK ABL 2100A
Die attach adhesive designed for lead-free array packaging
10 cc
TEKOPU ABLESTIK ABP 6389
TEKOPU
TEKOPU ABLESTIK ABP 6389
Conductive die-attach adhesive for high-reliability package applications
5 cc
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