TEKOPU ABLESTIK 2332-17

Description

TEKOPU ABLESTIK 2332-17 is a solvent-free epoxy adhesive for assembly bonding. It bonds to a wide variety of surfaces, including copper, aluminum, nickel, FRP, rigid plastics and oily steel. The product develops high bond strength when cured at temperatures as low as 100°C to 130°C (212°F to 266°F). It combines flexibility at low temperatures plus high peel and tensile shear strength over a broad temperature range.

Product detail

This 1-part, black epoxy adhesive for assembly bonds to a wide array of substrates, such as copper, aluminum and nickel.

Sizes and packaging

SKU

88811IB