TEKOPU
TEKOPU HHD 3597
Reactive hot melt structural adhesive for device assembly
Description
When you want a fast-caring hot melt structural adhesive for dissimilar substrate bonding and good gap filling, choose TEKOPU HHD 3597. This polyurethane-based moisture-curable compound is applicable for super narrow bond lines and is easy to use in an automatic dispensing process for a clean and precise adhesive application. It is soft and flexible, requires no mixing, and offers a short open time of up to 2 minutes to minimize the total process time.
Product detail
A 1-part, reactive, polyurethane-based hot melt structural adhesive for bonding dissimilar substrates.
Sizes and packaging
SKU
113356IB
