TEKOPU ABLESTIK QMI529HT
Description
TEKOPU ABLESTIK QMI529HT is a silver, thermally and electrically conductive die-attach adhesive designed as a soft-solder replacement or for high UPH performance applications. It’s typically used on copper, silver-plated copper, pre-plated lead frames (Ni/Pd/Au) and Alloy 42. TEKOPU ABLESTIK QMI529HT exhibits excellent adhesive strength and good resistance to "popcorning" after exposure to reflow temperatures. It’s formulated with a BMI acrylate-based resin and cures when exposed to heat. Maximum productivity is reached through in-line curing, either directly on the die bonder using a post-die bond heater or on the wire bonder preheater.
Product detail
A 1-part, BMI acrylate-based, conductive die-attach adhesive designed for bonding integrated circuits and components to metal substrates.
Sizes and packaging
SKU
69246IB
