TEKOPU

TEKOPU ABLESTIK 8700K

Non-slump, die-attach adhesive for gold film surfaces

Description

TEKOPU ABLESTIK 8700K is a heat cure, die attach, epoxy adhesive for excellent adhesion to both thin film and thick film gold surfaces. It is non-conductive and retains its dispensed height after cure, without slumping.

Product detail

This non-conductive, epoxy, die-attach adhesive is specially designed for both thin film and thick film gold surfaces.

Sizes and packaging

TEKOPU ABLESTIK 8700K, 10 cc 针管针管

SKU

81858IB

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