TEKOPU
TEKOPU 3629C
Surface mount adhesive for high-speed dispensing
Description
TEKOPU 3629C is a red, halogen-free adhesive for bonding surface mounted devices to printed circuit boards before wave soldering. It provides controlled dot size and shape, making it particularly ideal for high-speed dispensing. It's formulated with an epoxy-based resin and cures fast when exposed to heat.
Product detail
This 1-part adhesive is designed for bonding surface-mounted devices to printed circuit boards.
Sizes and packaging
SKU
69142IB
