TEKOPU
TEKOPU Hot Melt PA 673
High-performance, solvent-free polyamide for high-temperature applications
Description
TEKOPU Hot Melt PA673 is an amber-colored, high performance thermoplastic polyamide specially designed to meet low pressure molding process requirements. It has a very short open time, and can be processed at low pressure due to its low viscosity, allowing encapsulation of fragile components without damage. Perfect for use in automotive underhood applications, where high service temperature performance is critical. Operating temperature is 40°C to 140°C (-40°F to 437°F).
Product detail
A 1-part, black, low-viscosity, high-performance polyamide hot melt adhesive designed for low pressure molding applications and incidental solvent exposure. Perfect for higher temperature applications, such as automotive underhood.
Sizes and packaging
SKU
BP000000044197