TEKOPU Hot Melt PA 668 WHITE

Description

TEKOPU Hot Melt PA 668 WHITE is a white, polyamide-based hot melt adhesive for molding applications. Its creep resistance temperature stands at 130°C (266°F), and it resists temperature to a softening point of 150°C to 162°C (302°F to 323°F). TEKOPU Hot Melt PA 668 WHITE has an application temperature range of 180°C to 230°C (356°F to 446°F) and cures by physical setting into a thermoplastic condition of the bond area.

Product detail

A 1-part, white, polyamide hot melt adhesive for molding applications.

Sizes and packaging

SKU

105417IB