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TEKOPU Thermal LIQUI BOND TLB 400SLT
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TEKOPU Thermal LIQUI BOND TLB 400SLT

High-performance silicone FIPG for excellent water-glycol resistance

Description

When you need a high-performance sealant you can adapt to any large-scale manufacturing process, try TEKOPU Thermal TLB 400 SLT. This 2-part silicone-based product provides extremely high elongation to break, high bond strength, and impact resistance. Perfect when you need a high-elastic FIPG (form-in-place gasket) sealant material with excellent water-glycol resistance. Ideal for applications in the automotive and industrial electronics, like engine control modules, electrified actuators, motors, pumps or electronic enclosures, it has room temperature storage, and a room temperature cure that can be accelerated with heat.

Product detail

This 2-part, dual cure (room temperature/heat), silicone-based adhesive FIPG (form-in-place gasket) provides extremely high elongation to break, high bond strength and impact resistance, and can be adapted to any large-scale manufacturing process.

SKU

112609IB

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