TEKOPU Thermal HI FLOW THF 1600P

Description

TEKOPU Thermal HI FLOW THF 1600P is an electrically insulating, thermally conductive 55°C (131°F) phase change material with high temperature reliability (150°C / 302°F). Its polymide film provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The easy-release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.

Product detail

This high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement is designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.

Sizes and packaging

SKU

112261IB