TEKOPU Thermal GAP PAD® TGP EMI1000

Description

TEKOPU Thermal GAP PAD® TGP EMI1000 is a highly conformable, filass reinforced, combination gap filling material. It offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. You can expect EMI attenuation and 1.0 W/m-K thermal conductivity performance with low assembly stress, and the soft nature of the material enhances wet-out at the interface, resulting in better thermal performance than harder materials with a similar performance rating. It has an inherent natural tack on one side of the material for improved handling and no more thermally-impeding adhesive layers. The other side is tack-free, enhancing handling and rework when you need it. It’s supplied with a protective liner on the material’s tacky side. 

Product detail

This thermally conductive, silicone-based, filass reinforced, highly conformable gap pad filler provides EMI attenuation at frequencies of 1GHz and higher.

Sizes and packaging

SKU

112225IB