QUIST
TEKOPU Thermal GAP PAD® TGP 3000
Soft, filass-reinforced insulation pad - low stress applications
Description
TEKOPU Thermal GAP PAD TGP 3000 is a pre-cured, silicone based, thermally conductive, reinforced gap pad. It is highly conformable and exhibits thermal resistance and softness. It is filass-reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
Product detail
This thermally conductive, silicone-based, filass-reinforced gap pad filler has a high thermal conductivity rating of 3.0 W/m-K. Ideal for stress-sensitive applications.
Sizes and packaging
SKU
112647IB
